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6-Layer CuClad 217 PCB
PCB Material:CuClad 217 + RF-27 / 3.5mm
MOQ:1PCS
Price:39.99-299 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:13-20 working days
Payment Method:T/T, Paypal
 

6-Layer CuClad 217 RF PCB with 3.5mm Thick Core and ENIG Finish


1.Product Introduction: High-Performance PTFE Composite

Rogers CuClad 217 represents a premium cross-plied, woven fiberglass reinforced PTFE composite laminate, engineered to deliver the industry's lowest dielectric constant (Dk=2.17/2.20) among fiberglass-PTFE materials. This 6-layer construction utilizes a unique alternating ply orientation (90° fiberglass weave) combined with high PTFE content to achieve exceptional electrical isotropy and signal integrity for mission-critical RF applications. The material's optimized fiberglass/PTFE ratio enables faster signal propagation and superior signal-to-noise ratios compared to conventional PTFE laminates.


2.Key Material Properties

Ultra-Low Dielectric Constant: 2.17/2.20 @10GHz/1MHz
Minimal Signal Loss: 0.0009 dissipation factor @10GHz
Environmental Stability: 0.02% moisture absorption
Mechanical Reliability: 14 lbs/in peel strength
Space-Qualified: TML 0.01%, CVCM 0.01% outgassing
Thermal Performance: -55°C to +150°C operational range


3.PCB Construction Details

Base MaterialCuClad 217 / RF-27 Prepreg
Layer Count6-Layer
Board Dimensions68.45mm × 97.18mm (±0.15mm)
Minimum Trace/Space5/7 mils
Minimum Hole Size0.4mm
Via ConfigurationL1-L4 Blind Vias + Through-hole
Finished Thickness3.5mm
Copper Weight1oz (35μm) all layers
Via Plating Thickness20μm
Surface FinishImmersion Gold (ENIG)
Top SilkscreenWhite
Bottom SilkscreenNone
Top Solder MaskGreen
Bottom Solder MaskNone
Electrical Testing100% tested prior to shipment


4.PCB Stackup:

Copper layer 1 - 35 μm
Rogers CuClad 217 Core - 1.575 mm (62mil)
Copper layer 2 - 35 μm
Bonding ply - RF-27 -0.05mm
Copper layer 3 - 35 μm
Rogers CuClad 217 Core - 0.787 mm (31mil)
Copper layer 4 - 35 μm
Bonding ply - RF-27 -0.05mm
Copper layer 5 - 35 μm
Rogers CuClad 217 Core - 0.787 mm (31mil)
Copper layer 6 - 35 μm


5.Board Statistics

Components: 31
Total Pads: 143
Thru Hole Pads: 116
Top SMT Pads: 27
Bottom SMT Pads: 0
Vias: 39
Nets: 2


6.Manufacturing & Quality Standards

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping


7.Technical Advantages

Cross-Plied Construction: 90° alternating weave for uniform Dk
High PTFE Content: Lowest loss among fiberglass-PTFE laminates
Blind Via Capability: L1-L4 microvia integration
Space-Qualified: Meets NASA outgassing standards
Design Flexibility: Supports wider traces for reduced insertion loss


8.Target Applications

Radars
Electronic Countermeasures
Electronic Support Measures
Microwave Components (LNAs, filters, couplers, etc.)


 

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